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TRAP
  • Prevents pump trip caused by Powder during manufacturing process
  • MinimizesFore line blockage
  • Extends dry pump lifetime
  • Improves productivity of Wafers
NTHC50
  • Hot & cold method collects powder through temperature difference, protecting the pump and removing the foreline powder.
  • Maximized space-efficiency due to maximum capacity (50L)
  • Gas-optimized collection structure
  • Creates lower buffer layer (heater + cooling + structure; all separated)
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NTHC50
SPECIFICATION
Dimension Exterior (W×D×H) 350㎜×480㎜×390㎜
In, Out Flange ISO-KF50
Water Connector 1/4" Quick Connector
Gas Flow Max : 500slm
TC1 Heater Module 1EA
TC2 Cooling Module 1EA
Bimetal 200℃ 1EA
Heater Connector MS 3102 Connector
Volume Inside 50Liter
Weight Only TRAP 48㎏
Material Structure STS304
Heater INCONEL600
Performance Heater TEMP. 300~400℃
Power Consumption 1.5㎾(Normal)
Power Supply 220V/60㎐, 1P3W
 
ISO 9001:2000 Venture Business/Inno-biz